Semiconductor manufacturing process modules

ABSTRACT

A variety of process modules are described for use in semiconductor manufacturing processes.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part of U.S. application Ser. No.11/681,978 filed on Mar. 5, 2007, now abandoned whichcontinuation-in-part of U.S. application Ser. No. 11/679,829 filed onFeb. 27, 2007, which claims the benefit of U.S. Prov. App. No.60/777,443 filed on Feb. 27, 2006. U.S. application Ser. No. 11/681,978is also a continuation-in-part of U.S. application Ser. No. 10/985,834filed on Nov. 10, 2004 which claims the benefit of U.S. Prov. App. No.60/518,823 filed on Nov. 10, 2003 and U.S. Prov. App. No. 60/607,649filed on Sep. 7, 2004.

This application also claims the benefit of the following U.S.applications: U.S. Prov. App. No. 60/779,684 filed on Mar. 5, 2006; U.S.Prov. App. No. 60/779,707 filed on Mar. 5, 2006; U.S. Prov. App. No.60/779,478 filed on Mar. 5, 2006; U.S. Prov. App. No. 60/779,463 filedon Mar. 5, 2006; U.S. Prov. App. No. 60/779,609 filed on Mar. 5, 2006;U.S. Prov. App. No. 60/784,832 filed on Mar. 21, 2006; U.S. Prov. App.No. 60/746,163 filed on May 1, 2006; U.S. Prov. App. No. 60/807,189filed on Jul. 12, 2006; and U.S. Prov. App. No. 60/823,454 filed on Aug.24, 2006.

All of the foregoing applications are commonly owned, and all of theforegoing applications are incorporated herein by reference.

BACKGROUND

1. Field

The invention herein disclosed generally relates to semiconductorprocessing systems in a vacuum environment, and specifically relates toconfigurations of handling and process chambers for semiconductorprocessing in a vacuum environment.

2. Description of the Related Art

In a conventional semiconductor manufacturing system, a number ofdifferent process modules are interconnected within a vacuum or otherenvironment and controlled to collectively process semiconductor wafersfor various uses. The complexity of these manufacturing systemscontinues to grow both due to the increased complexity of processinglarger wafers with smaller features, and due to the increasingpossibilities for using a single system for several different end-to-endprocesses, as described for example in commonly-owned U.S. applicationSer. No. 11/679,829 filed on Feb. 27, 2007. As the complexity of afabrication system grows, it becomes increasingly difficult to scheduleresources within the system in a manner that maintains good utilizationof all the various process modules. While a part of this difficultyflows from the complexity of the processing recipe itself, another partof the difficulty comes from the differences in processing time forvarious processing steps. The generally high acquisition and operatingcosts of production semiconductor vacuum processing systems dictate highutilization of the handling, processing, and other modules within thesystems.

Within a family of similar semiconductor products, or within a range offamilies within a technology, at least some of the processing steps maybe commonly applied to all wafers. However, because of the uniqueprocessing requirements to achieve the final semiconductor device,sharing common processing steps may be very difficult with fixedprocessing systems. While it may be possible to share these commonprocess steps by configuring them as separate machines, everymachine-to-machine transfer imposes time delays and risks ofcontamination As a result, duplication of equipment, and the resultingunderutilization of the equipment, is a common challenge withsemiconductor vacuum processing operation in a semiconductor fabricationfacility.

There remains a need for process modules adapted to currentsemiconductor manufacturing needs, and in particular, for processmodules that can help to balance load, increase throughput, and improveutilization within complex processing systems.

SUMMARY

A variety of process modules are described for use in semiconductormanufacturing processes.

In one aspect, a device disclosed herein includes a single entry shapedand sized for passage of a single wafer; an interior chamber adapted tohold a plurality of wafers in a side-by-side configuration; a slot valveoperable to selectively isolate the interior chamber; and a tool forprocessing the plurality of wafers within the interior chamber.

The plurality of wafers may consist of two wafers. The two wafers may beequidistant from the single entry. The two wafers may be in line withthe single entry. The plurality of wafers may consist of three entries.The plurality of wafers may be arranged in a triangle. The device mayinclude a wafer handler within the interior chamber, the wafer handlerrotatable to position one of the plurality of wafers nearest to thesingle entry. The tool may process one of the plurality of wafers at atime. The device may include a single robotic arm adapted to place orretrieve any one of the plurality of wafers within the interior chamber.

In another aspect, a device disclosed herein includes an interiorchamber adapted to hold a plurality of wafers; a first entry to theinterior chamber shaped and size for passage of a single wafer andselectively isolated with a first slot valve; a second entry to theinterior chamber shaped and size for passage of a single wafer andselectively isolated with a second slot valve; and a tool for processingthe plurality of wafers within the interior chamber.

The first entry and the second entry may be positioned for access by tworobotic arms positioned for a robot-to-robot hand off. The first entryand the second entry may be positioned for access by two robotic armshaving center axes spaced apart by less than twice a wafer diameter. Thefirst entry and the second entry may be positioned for access by twoadjacent robotic arms positioned for hand off using a buffer location.The device may include two robotic arms, each one of the robotic armspositioned to access one of the first and second entries, and therobotic arms operable to concurrently place at least two wafers into theinterior chamber substantially simultaneously. The device may includetwo robotic arms and a buffer sharing a common isolation environment,each one of the robotic arms positioned to access one of the first andsecond entries and adapted to transfer one of the plurality of wafers tothe other one of the robotic arms using the buffer. The device mayinclude a third entry to the interior chamber shaped and size forpassage of a single wafer and selectively isolated with a third slotvalve.

In another aspect, a device disclosed herein includes an entry shapedand size for passage of at least one wafer, the entry having a widthsubstantially larger than the diameter of the at least one wafer; aninterior chamber adapted to hold a plurality of wafers; a slot valveoperable to selectively isolate the interior of the chamber; and a toolfor processing the plurality of wafers within the interior chamber.

The entry may be adapted to accommodate linear access by a robot to aplurality of wafers within the interior chamber. The entry may have awidth at least twice the diameter of one of the plurality of wafers.

In another aspect, a device disclosed herein includes a first entryshaped and sized for passage of a wafer; a first interior accessiblethrough the first entry; a first slot valve operable to selectivelyisolate the first interior; a second entry shaped and sized for passageof the wafer; a second interior accessible through the second entry; anda second slot valve operable to selectively isolate the second interior.

The device may include a robotic arm adapted to access the firstinterior and the second interior. The robotic arm may include afour-link SCARA arm. The device may include two robotic arms, includinga first robotic arm adapted to access the first interior and a secondrobotic arm adapted to access the second interior. The first robotic armand the second robotic arm may be separated by a buffer station. Thefirst interior may include a vacuum sub-chamber adapted for independentprocessing of wafers. The second interior may include a second vacuumsub-chamber having a different processing tool than the first interior.The second interior may be separated from the first interior by a wall.The first entry and the second entry may be substantially coplanar. Thefirst entry may form a first plane angled to a second plane formed bythe first entry. The device may include a robotic arm adapted to accessthe first entry and the second entry, wherein the first plane and thesecond plane are substantially normal to a line through a center axis ofthe robotic arm. The device may include a third entry shaped and sizedfor passage of a wafer, a third interior accessible through the thirdentry, and a third slot valve operable to selectively isolate the thirdinterior.

In another aspect, a device disclosed herein includes a first entryshaped and sized for passage of a wafer; an interior chamber adapted tohold a wafer; a second entry shaped and sized for passage of the wafer,the second entry on an opposing side of the interior chamber from thefirst entry; a slot valve at each of the first and second entries, theslot valves operable to selectively isolate the interior chamber; and atool for processing the wafer within the interior chamber.

The devices disclosed herein may be combined in various ways within asemiconductor fabrication system, for example to form fabricationfacilities adapted to balance processing load among relatively fast andrelatively slow processes, or between processes amenable to batchprocessing and processes that are dedicated to a single wafer.

In one aspect, a system disclosed herein includes a plurality of processmodules coupled together to form a vacuum environment, the plurality ofprocess modules including at least one process module selected from thegroup consisting of an in-line process module, a dual-entry processmodule, and a wide-entry process module; one or more robot handlerswithin the vacuum environment adapted to transfer wafers among theplurality of process modules; and at least one load lock adapted totransfer wafers between the vacuum environment and an externalenvironment.

The system may include at least one multi-wafer process module having anentry shaped and sized for passage of a single wafer.

These and other systems, methods, objects, features, and advantages ofthe present invention will be apparent to those skilled in the art fromthe following detailed description of the preferred embodiment and thedrawings. All documents mentioned herein are hereby incorporated intheir entirety by reference.

BRIEF DESCRIPTION OF THE FIGURES

The invention and the following detailed description of certainembodiments thereof may be understood by reference to the followingfigures:

FIG. 1 depicts a generalized layout of a vacuum semiconductormanufacturing system.

FIG. 2 shows a multi-wafer process module.

FIG. 3 shows a multi-wafer process module.

FIG. 4 shows a multi-wafer process module.

FIG. 5 shows a multi-wafer process module.

FIG. 6 shows adjacent process modules sharing a controller.

FIG. 7 shows two robotic arms sharing a buffer.

FIG. 8 shows dual entry process modules.

FIG. 9 shows dual entry process modules.

FIG. 10 shows a process module with an oversized entry.

FIG. 11 shows side-by-side process modules.

FIG. 12 shows multi-process modules.

FIG. 13 shows multi-process modules.

FIG. 14 shows multi-process modules.

FIG. 15 shows an in-line process module in a layout.

FIG. 16 shows a layout using dual entry process modules.

FIG. 17 shows a layout using dual entry process modules.

FIG. 18 shows a process module containing a scanning electronmicroscope.

FIG. 19 shows a process module containing an ion implantation system.

FIG. 20 shows a layout using a scanning electron microscope module.

FIG. 21 shows a layout using an ion implantation module.

FIG. 22 illustrates a fabrication facility including the placement ofoptical sensors for detection of robotic arm position and materials inaccordance with embodiments of the invention.

FIGS. 23A, 23B and 23C illustrate a fabrication facility in across-sectional side view showing optical beam paths and alternativesbeam paths.

FIGS. 24A and 24B illustrate how optical sensors can be used todetermine the center of the material handled by a robotic arm.

FIG. 25A shows high-level components of a linear processing architecturefor handling items in a manufacturing process.

FIG. 25B illustrates a vertically arranged load lock assembly inaccordance with embodiments of the invention.

FIG. 25C illustrates a vertically arranged load lock assembly at bothsides of a wafer fabrication facility in accordance with embodiments ofthe invention.

FIG. 26 shows a vertically arranged load lock and vertically stackedprocess modules in accordance with embodiments of the invention.

FIG. 27 shows a linearly arranged, two-level handling architecture withvertically stacked process modules in a cross-sectional side view inaccordance with embodiments of the invention.

FIG. 28 shows the handling layout of FIG. 27 in a top view.

FIG. 29 shows an instrumented object on a robotic arm with sensors todetect proximity of the object to a target, in accordance withembodiments of the invention.

FIG. 30 illustrates how the movement of sensors over a target can allowthe robotic arm to detect its position relative to the obstacle.

FIG. 31 shows how an instrumented object can use radio frequencycommunications in a vacuum environment to communicate position to acentral controller.

FIG. 32 illustrates the output of a series of sensors as a function ofposition.

FIGS. 33A-33C show a multi-shelf buffer for use in a batch processingsystem.

FIG. 34 shows an external return system for a handling system having alinear architecture.

FIG. 34A shows a U-shaped configuration for a linear handling system.

FIG. 35 shows certain details of an external return system for ahandling system of FIG. 34.

FIG. 36 shows additional details of an external return system for ahandling system of FIG. 34.

FIG. 37 shows movement of the output carrier in the return system ofFIG. 34.

FIG. 38 shows handling of an empty carrier in the return system of FIG.34.

FIG. 39 shows movement of the empty carrier in the return system of.FIG. 34 into a load lock position.

FIG. 40 shows the empty carrier lowered and evacuated and movement ofthe gripper in the return system of FIG. 34.

FIG. 41 shows an empty carrier receiving material as a full carrier isbeing emptied in the return system of FIG. 34.

FIG. 42 shows an empty carrier brought to a holding position, starting anew return cycle in the return system of FIG. 34.

FIG. 43 shows an architecture for a handling facility for amanufacturing process, with a dual-arm robotic arm system and a returnsystem in a linear architecture.

FIG. 44 shows an alternative embodiment of an overall systemarchitecture for a handling method and system of the present invention.

FIG. 45 illustrates a fabrication facility including a mid-entryfacility.

DETAILED DESCRIPTION

FIG. 1 shows a generalized layout of a semiconductor manufacturingsystem. The system 100 may include one or more wafers 102, a load lock112, one or more transfer robots 104, one or more process modules 108,one or more buffer modules 110, and a plurality of slot valves 114 orother isolation valves for selectively isolated chambers of the system100, such as during various processing steps. In general operation, thesystem 100 operates to process wafers for use in, for example,semiconductor devices.

Wafers 102 may be moved from atmosphere to the vacuum environmentthrough the load lock 112 for processing by the process modules 108. Itwill be understood that, while the following description is generallydirected to wafers, a variety of other objects may be handled within thesystem 100 including a production wafer, a test wafer, a cleaning wafer,a calibration wafer, or the like, as well as other substrates (such asfor reticles, magnetic heads, flat panels, and the like), includingsquare or rectangular substrates, that might usefully be processed in avacuum or other controlled environment. All such workpieces are intendedto fall within the scope of the term “wafer” as used herein unless adifferent meaning is explicitly provided or otherwise clear from thecontext.

The transfer robots 104, which may include robotic arms and the like,move wafers within the vacuum environment such as between processmodules, or to and from the load lock 112.

The process modules 108 may include any process modules suitable for usein a semiconductor manufacturing process. In general, a process module108 includes at least one tool for processing a wafer 102, such as toolsfor epitaxy, chemical vapor deposition, physical vapor deposition,etching, plasma processing, lithography, plating, cleaning, spincoating, and so forth. In general, the particular tool or tools providedby a module 108 are not important to the systems and methods disclosedherein, except to the extent that particular processes or tools havephysical configuration requirements that constrain the module design 108or wafer handling. Thus, in the following description, references to atool or process module will be understood to refer to any tool orprocess module suitable for use in a semiconductor manufacturing processunless a different meaning is explicitly provided or otherwise clearfrom the context.

Various process modules 108 will be described below. By way of exampleand not limitation, the process modules 108 may have various widths,such as a standard width, a doublewide width, a stretched width, or thelike. The width may be selected to accommodate other system components,such as two side-by-side transfer robot modules, two transfer robotmodules separated by a buffer module, two transfer robot modulesseparated by a transfer station, or the like. It will be understood thatthe width may instead be selected to accommodate more robots, such asthree robots, four robots, or more, either with or without buffersand/or transfer stations. In addition, a process module 108 mayaccommodate a plurality of vacuum sub-chamber modules within the processmodule 108, where access to the vacuum sub-chamber modules may be from aplurality of transfer robot modules through a plurality of isolationvalves. Vacuum sub-chamber modules may also accommodate single wafers orgroups of wafers. Each sub-chamber module may be individuallycontrolled, to accommodate different processes running in differentvacuum sub-chamber modules.

A number of buffer modules 110 may be employed in the system 100 totemporarily store wafers 102, or facilitate transfer of wafers 102between robots 104. Buffer modules 110 may be placed adjacent to atransfer robot module 104, between two transfer robot modules 104,between a transfer robot module 104 and an equipment front-end module(“EFEM”), between a plurality of robots 104 associated with modules, orthe like. The buffer module 110 may hold a plurality of wafers 102, andthe wafers 102 in the buffer module 110 may be accessed individually orin batches. The buffer module 110 may also offer storage for a pluralityof wafers 102 by incorporating a work piece elevator, or multi-levelshelving (with suitable corresponding robotics). Wafers 102 may undergoa process step while in the buffer module 110, such as heating, cooling,cleaning, testing, metrology, marking, handling, alignment, or the like.

The load lock 112 permits movement of wafers 102 into and out of thevacuum environment. In general, a vacuum system evacuates the load lock112 before opening to a vacuum environment in the interior of thesystem, and vents the load lock 112 before opening to an exteriorenvironment such as the atmosphere. The system 100 may include a numberof load locks at different locations, such as at the front of thesystem, back of the system, middle of the system, and the like. Theremay be a number of load locks 112 associated with one location withinthe system, such as multiple load locks 112 located at the front of thelinear processing system. In addition, front-end load locks 112 may havea dedicated robot and isolation valve associated with them for machineassisted loading and unloading of the system. These systems, which mayinclude EFEMs, front opening unified pods (“FOUPs”), and the like, areused to control wafer movement of wafers into and out of the vacuumprocessing environment.

The isolation valves 114 are generally employed to isolate processmodules during processing, or to otherwise isolate a portion of thevacuum environment from other interior regions. Isolation valves 114 maybe placed between other components to temporarily isolate theenvironments of the system 100, such as the interior chambers of processmodules 108 during wafer processing. An isolation valve 114 may open andclose, and provide a vacuum seal when closed. Isolation valves 114 mayhave a variety of sizes, and may control entrances that are serviced byone or more robots. A number of isolation valves 114 are described ingreater detail below.

Other components may be included in the system 100. For example, thesystem 100 may include a scanning electron microscope module, an ionimplantation module, a flow through module, a multifunction module, athermal bypass module, a vacuum extension module, a storage module, atransfer module, a metrology module, a heating or cooling station, orany other process module or the like. In addition these modules may bevertically stacked, such as two load locks stacked one on top of theother, two process modules stacked one on top of the other, or the like.

It will be understood that, while FIG. 1 shows a particular arrangementof modules and so forth, that numerous combinations of process modules,robots, load locks, buffers, and the like may suitably be employed in asemiconductor manufacturing process. The components of the system 100may be changed, varied, and configured in numerous ways to accommodatedifferent semiconductor processing schemes and customized to adapt to aunique function or group of functions. All such arrangements areintended to fall within this description. In particular, a number ofprocess modules are described below that may be used with asemiconductor processing system such as the system 100 described withreference to FIG. 1.

FIG. 2 shows a multi-wafer process module. The module 202 may include aprocessing tool (not shown) for processing wafers 204 disposed in aninterior thereof. Access to the interior may be through an entry 206that includes an isolation valve or the like operable to selectivelyisolate the interior of the module 202. A robot 208 may be positionedoutside the entry 206, and adapted to place wafers 204 in the interior,or to retrieve the wafers 204 from the interior. In the embodiment ofFIG. 2, the module 202 is adapted to receive two wafers 204 side by sideand substantially equidistant from the entry 206 and the robot 208. Inthis arrangement, a clear access path is provided for the robot 208 toeach wafer 204, and the symmetry may advantageously simplify design ofthe module 202.

In general the size of the entry 206 would be only wide enough and tallenough to accommodate a single wafer 204, along with an end effector andany other portions of the robot that must pass into the interior duringhandling. This size may be optimized by having the robot 208 move wafersstraight through a center of the entry 206, which advantageouslyconserves valuable volume within the vacuum environment. However, itwill be understood that the size of the wafer 204 may vary. For example,while 300 mm is a conventional size for current wafers, new standardsfor semiconductor manufacturing provide for wafers over 400 mm in size.Thus it will be understood that the shape and size of components (andvoids) designed for wafer handling may vary, and one skilled in the artwould understand how to adapt components such as the entry 206 toparticular wafer dimensions. In other embodiments, the entry 206 may bepositioned and sized to provide a straight-line path from the wafer'sposition within the module 202 and the wafer's position when at a center210 of a chamber 212 housing the robot 208. In other embodiments, theentry 206 may be positioned and sized to provide a straight-line pathfrom the wafer's position within the module 202 and a center axis of therobot 208 (which will vary according to the type of robotic armemployed).

FIG. 3 shows a multi-wafer process module. The module 302 typicallyincludes one or more tools to process wafers 304 therein. As depicted,the three wafers 304 may be oriented in a triangle. The entry 306 may beshaped and sized for passage of a single wafer, or may be somewhat widerto accommodate different paths for wafer passage in and out of aninterior of the module 302. It will be understood that otherarrangements of three wafers 304 may be employed, including wafersspaced radially equidistant from a center 310 of a robot handling module312, or linearly in various configurations. It will also be understoodthat, unless the robot 308 has z-axis or vertical movement capability,the wafer 304 closest to the entrance 306 must generally be placed inlast and removed first.

FIG. 4 shows a multi-wafer process module. This module 402 positions twowafers 404 in-line with the entry 406, which may advantageously permitthe robot 408 to employ a single linear motion for accessing both wafers404.

FIG. 5 shows a multi-wafer process module. This module 502 includes awafer handler 520 adapted to move wafers 504 within the module 502. Inone embodiment, the wafer handler 520 may operate in a lazy-Suzanconfiguration to rotate one of the wafers 504 nearest to the entry 512.In this configuration, the wafer handler 520 may also rotate wafers 504on the rotating handler 520 (using, for example, individual motors or aplanetary gear train) to maintain rotational alignment of each waferrelative to the module 502. It will be understood that, while a rotatinghandler is one possible configuration for the handler 520 thatadvantageously provides a relatively simple mechanical configuration,other arrangements are also possible including a conveyer belt, a Ferriswheel, a vertical conveyer belt with shelves for wafers, an elevator,and so forth. In general, any mechanical system suitable foraccommodating loading of multiple wafers into the module 502, andpreferable systems that accommodate use of an entry 512 sized for asingle wafer and/or systems that reduce the required reach of robotsinto the module, may be useful employed in a multi-wafer process moduleas described herein.

FIG. 6 shows a controller shared by a number of process modules. In aconventional system, each process module has a controller adaptedspecifically for control of hardware within the process module. Thesystem 600 of FIG. 6 includes a plurality of process modules 602 whichmay be any of the process modules described above, and may performidentical, similar, or different processes from one another. Asdepicted, two of the modules 602 are placed side-by-side and share acontroller 604. The controller 604 may control hardware for both of theside-by-side modules 602, and provide an interface for externalaccess/control. In addition, sensors may be associated with the modules602 to provide data to the controller 604, as well as to recognize whena module is attached to an integrated processing system. Using a sharedcontroller 604, which may be a generic controller suitable for use withmany different types of modules 602 or a module-specific controller,advantageously conserves space around process modules 602 permittingdenser configurations of various tools, and may reduce costs associatedwith providing a separate controller for each process module 602. Themodules 602 may also, or instead, share facilities such as a gas supply,exhaust(s), water, air, electricity, and the like. In an embodiment, theshared controller 604 may control shared facilities coupled to themodules 602.

FIG. 7 shows two robotic arms sharing a buffer. In this system 700, tworobots 702 transfer wafers via a buffer 704. It will be noted that noisolation valves are employed between the robots 702 and/or the buffer704. This arrangement may advantageously reduce or eliminate the needfor direct robot-to-robot hand offs (due to the buffer 704), and permitcloser spacing of robots 702 because no spacing is required forisolation valves. The buffer 704 may include multiple shelves or otherhardware for temporary storage of wafers. In one embodiment, the buffer704 has a number of vertically stacked shelves, and remains stationarywhile robotic arms 702 move vertically to pick and place on differentshelves. In another embodiment, the buffer 704 has a number ofvertically stacked shelves, and the buffer 704 moves vertically to bringa specific shelf to the height of one of the robots 702. In thisembodiment, each robot may have an end effector or the like with adifferent elevation so that both robots 702 can access the buffer 704simultaneously without collision. In other embodiments, the endeffectors of different robots 702 may have complementary shapes toaccommodate simultaneous linear access, or may have offset linearpositions so that fingers of each end effector do not collide when bothrobots 702 are accessing the buffer 704. More generally, it will beappreciated that numerous physical arrangements may be devised for arobotic system 700 that includes two or more robots 702 sharing a buffer704 within a single isolation chamber. In other embodiments, two or morebuffers 704 may also be employed. Each robot may also have multiple endeffectors stacked vertically, which allows the robot to transfermultiple wafers simultaneously.

FIG. 8 shows a layout for dual-entry process modules. In the system 800of FIG. 8, double-wide process modules 802 include two different entries804, each having an isolation valve for selectively coupling an interiorof the process module 802 to an external environment. As depicted, theexternal environment of FIG. 8 includes a single volume 806 (i.e., ashared or common environment without isolation valves) that contains tworobots 808 and a buffer 810. In this embodiment, the robots 808 may handoff to one another using shelves or the like within the buffer 810, asgenerally described above. It will be understood that the robots 808 mayalso, or instead, directly hand off to one another. Each process module802 may concurrently hold and process a number of wafers, such as twowafers, three wafers, four wafers, and so forth. It will be readilyunderstood that two wafers may be directly accessed by the two robots808 and entries 804, permitting parallel handling of wafers through theside-by-side entries 804. Thus, for example, two wafers (or more wafersusing, e.g., batch end effectors or the like), may be simultaneouslytransferred from the process module 802 depicted on the left of FIG. 8and the process module 802 depicted on the right of FIG. 8. In addition,the dual processing chamber may advantageously employ shared facilities,such as gasses, vacuum, water, electrical, and the like, which mayreduce cost and overall footprint. This arrangement may be particularlyuseful for a module 802 having long process times (for example, in therange of several minutes) by permitting concurrent processing and/orhandling of multiple wafers.

FIG. 9 shows a layout for a dual-entry process module. In the embodimentof FIG. 9, the robotic handlers are in chambers 902 isolated from oneanother by a buffer 904 with isolation valves 906. This configuration ofrobotics provides significant advantages. For example, the buffer 904may be isolated to accommodate interim processing steps such asmetrology or alignment, and may physically accommodate more wafers. Inaddition, this arrangement permits one of the robotic handlers to accessa load lock/EFEM in isolation from the other robotic handler and processmodules. However, this configuration requires greater separation betweenthe robotic handlers, and requires a correspondingly wider processmodule 908. As noted above, various internal transport mechanisms may beprovided within the process module 908 to permit movement of waferswithin the module to a position close to the entry or entries. However,in some embodiments, the process module 908 may only process two waferssimultaneously.

It will be understood that the embodiments of FIGS. 8-9 may be readilyadapted to accommodate three, four, or more entries with suitablemodifications to entries, modules, and robotics. All such variations areintended to fall within the scope of this disclosure. As with otherprocess modules described herein, these modules may also be readilyadapted to batch processing by providing, for example, verticallystacked shelves and robots with dual or other multiple end effectors.

FIG. 10 shows a process module with an over-sized entry. In theembodiment of FIG. 10, an entry 1002 to a process module 1004 may besubstantially wider than the diameter of wafers handled by the system1000. In general, the increased width of the entry 1002 and acorresponding isolation valve permits linear access by a robot 1006 tomore of the space within an interior chamber of the process module 1004.In embodiments, the entry 1002 may have a width that is 50% greater thanthe diameter of a wafer, twice the diameter of a wafer, or more thantwice the diameter of a wafer. In embodiments, the entry 1002 has awidth determined by clearance for linear robotic access (with a wafer)to predetermined positions within the process module 1004, such as thecorners of the module 1004 opposing the entry 1002, or other positionswithin the module 1004. While it is possible for robots to reach aroundcorners and the like, linear access or substantially linear accesssimplifies robotic handling and requires less total length of linkswithin a robotic arm. In one aspect, two such process modules 1004 mayshare a robotic handler, thereby permitting a high degree of flexibilityin placement and retrieval motions for wafers among the modules 1004.

FIG. 11 shows a dual entry process module. Each process module 1102 maybe a dual-entry process module having two entries as described, forexample with reference to FIG. 9 above. In the embodiment of FIG. 11, asingle robot 1104 may service each entry 1106 of one or more of theprocess modules 1102. Due to the long reach requirements, the robot 1104may include a four-link SCARA arm, a combination of telescoping andSCARA components, or any other combination of robotic links suitable forreaching into each entry 1106 to place and retrieve wafers in theprocess module(s) 1102.

FIG. 12 shows multi-process modules. In the embodiment of FIG. 12, aprocess module 1202 may include two (or more) vacuum sub-chambers 1204for independently processing wafers 1206. Each vacuum sub-chamber 1204may be separated from the other by a wall or similar divider that formstwo isolated interiors within the module 1202. Each vacuum sub-chamber1204 may, for example include one or more independent processing toolsand an independent vacuum environment in the corresponding interiorchamber selectively isolated with an isolation valve. In otherembodiments, each sub-chamber 1204 may include a shared tool thatindependently processes each wafer 1206, so that a single environment isemployed within the process module 1202 even through wafers areprocessed separately and/or independently. FIG. 13 shows a multi-processmodule system 1300 employing a buffer 1302 between robots 1304. Theisolation entries and/or isolation valves may be substantially coplanar,such as to abut linearly arranged robotic handlers or other planarsurfaces of handling systems.

FIG. 14 shows multi-process modules. In the embodiment of FIG. 14, eachprocess module 1402 may include a number of entries 1404 for selectiveisolation of the processing environment within the process modules 1402.In this embodiment, the entries 1404 for each module 1402 form planesthat are angled with respect to one another. In one embodiment, theseplanes are oriented substantially normal to a ray from a wafer centerwithin the module 1402 to a center of the robotic handler 1408 or acenter axis of the robotic handler 1408. This configuration provides anumber of advantages. For example, in this arrangement, a single robot1408 may have linear access to each process module 1402 sub-chamber.Further, three process modules 1402 may be arranged around a singlerobot 1408. As a significant advantage, this general configurationaffords the versatility of a cluster tool in combination with themodularity of individual process modules. It will be understood thatwhile FIG. 14 depicts each entry 1404 as servicing a single sub-chamberwithin a process module 1402, the process module 1402 may have a single,common interior where multiple wafers are exposed to a single process.

FIG. 15 shows an in-line process module in a layout. In the system 1500,each linear process module 1502 includes two entries 1504 onsubstantially opposite sides of the module 1502. This configurationfacilitates linear arrangements of modules by permitting a wafer to bepassed into the module 1502 on one side, processed with a tool (whichmay be, for example, any of the tools described above, and retrievedfrom the module 1502 on an opposing side so that multiple linear modules1502 and/or other modules may be linked together in a manner thateffectively permits processing during transport from one EFEM 1506 (orthe like) to another EFEM 1508. In one embodiment, the in-line processmodules may provide processes used for all wafers in the system 1500,while the other process modules may provide optional processes used onlyon some of the wafers. As a significant advantage, this layout permitsuse of a common system for different processes having partially similarprocessing requirements.

In general, the embodiments depicted above may be further expanded toincorporate additional processing modules and transfer robot modules.The following figures illustrate a number of layouts using the processmodules described above.

FIG. 16 shows a layout using dual entry process modules. In this system1600, two dual-entry process modules share a robotic handling systemwith a conventional, single process module. In an example deployment,the dual-entry process modules may implement relatively long processes,while the conventional module provides a single, short process. Therobotics may quickly transfer a series of wafers between the buffer andthe short process module while a number of wafers are being processed inthe dual entry process modules.

FIG. 17 shows a layout using dual entry process modules. In this system1700, two additional process modules are added. This may be useful, forexample, to balance the duty cycles of various process modules therebyproviding higher utilization of each module, or provide for moreefficient integration of relatively fast and slow processes or processmodules within a single environment.

FIG. 18 shows a process module containing a scanning electronmicroscope. The system 1800 may include an EFEM or FOUP 1802, an entry1804 including an isolation valve, a robotic handler 1806, and ascanning electron microscope 1808. The entry 1804 may provide selectiveisolation to the robotic handler 1806 and/or microscope 1808, and therobotic handler 1806 may transfer wafers between the microscope 1808 andthe rest of the system 1800. This general configuration may be employedto add a scanning electron microscope to a semiconductor manufacturingsystem in a manner similar to any other process module, whichadvantageously permits microscopic inspection of wafers without removingwafers from the vacuum environment, or to add a stand-alone microscopeto a vacuum environment fabrication facility

FIG. 19 shows a process module containing an ion implantation system.The system 1900 may include an EFEM or FOUP 1902, an entry 1904including an isolation valve, a robotic handler 1906, and an ionimplantation system 1908. The entry 1904 may provide selective isolationto the robotic handler 1906 and/or ion implantation system 1908, and therobotic handler 1906 may transfer wafers between the ion implantationsystem 1908 and the rest of the system 1900. This general configurationmay be employed to add an ion implantation tool to a semiconductormanufacturing system in a manner similar to any other process module,which advantageously permits ion implantation on wafers without removingwafers from the vacuum environment, or to add a stand-alone implantationsystem to a vacuum environment fabrication facility.

FIG. 20 shows a layout using a scanning electron microscope module. Asillustrated, the system 2000 includes a scanning electron microscopemodule 2002 with an integrated transfer robot 2004. This hardware isincorporated into the semiconductor processing system 2000, includingadditional transfer robotics, process modules, and EFEM. Such anembodiment may be useful for handling and setup of a microscopicscanning function within a vacuum processing environment, allowing thesemiconductor work piece to be kept in vacuum throughout the process,including intermittent or final inspection using electron microscopy.While the illustrated system 2000 includes two dual-entry processmodules as additional processing hardware, it will be understood thatany suitable combination of process modules may be employed with thesystems described herein.

FIG. 21 shows a layout using an ion implantation module. As illustrated,the system 2100 includes an ion implantation system 2102 and two robotichandlers 2104. This hardware is incorporated into the semiconductorprocessing system 2100, which includes additional transfer robotics,process modules, and two EFEMs. Such an embodiment may be useful forhandling and setup of ion implantation within a vacuum-processingenvironment, allowing the wafer to be kept in vacuum throughout amulti-step process that includes one or more ion implantation steps. Theprocess system is configured such that wafers that do not require ionimplantation may bypass the ion implantation system through two robotsand a buffer. Such a wafer may nonetheless be processed in other processmodules connected to the system 2100.

A linear process module 2106 may also be provided. This configurationmay be particularly useful in high-throughput processes so that abottleneck is avoided at either entry to or exit from the vacuumenvironment. In addition, the linear process module 2106 may besimultaneously or nearly simultaneously loaded from one entry whilebeing unloaded from the other entry.

FIG. 22 illustrates a fabrication facility including a series of sensors35002. In many fabrication facilities such sensors 35002 are commonlyused to detect whether a material 35014 is still present on a roboticarm 35018. Such sensors 35002 may be commonly placed at each vacuumchamber 4012 entry and exit point. Such sensors 35002 may consist of avertical optical beam, either employing an emitter and detector, oremploying a combination emitter/detector and a reflector. In a vacuumhandling facility, the training of robotic stations is commonlyaccomplished by a skilled operator who views the position of the robotarm and materials and adjusts the robot position to ensure that thematerial 35014 is deposited in the correct location. However, frequentlythese positions are very difficult to observe, and parallax and otheroptical problems present significant obstacles in properly training arobotic system. Hence a training procedure can consume many hours ofequipment downtime.

Several automated training applications have been developed, but theymay involve running the robotic arm into a physical obstacle such as awall or edge. This approach has significant downsides to it: physicallytouching the robot to an obstacle risks damage to either the robot orthe obstacle, for example many robot end effectors are constructed usingceramic materials that are brittle, but that are able to withstand veryhigh wafer temperatures. Similarly, inside many process modules thereobjects that are very fragile and easily damaged. Furthermore, it maynot be possible to employ these auto-training procedures with certainmaterials, such as a wafer 3 1008 present on the robot end effector.Moreover, the determination of vertical position is more difficultbecause upward or downward force on the arm caused by running into anobstacle is much more difficult to detect.

In the systems described herein, a series of sensors 35002-35010 mayinclude horizontal sensors 35004-35010 and vertical sensors 35002. Thiscombination of sensors 35002-35010 may allow detection, for examplethrough optical beam breaking, of either a robotic end effector, arm, ora handled object. The vertical sensor 35002 may be placed slightlyoutside the area of the wafer 31008 when the robotic arm 3501 8 is in aretracted position. The vertical sensor 35002 may also, or instead, beplaced in a location such as a point 35012 within the wafer that iscentered in front of the entrance opening and covered by the wafer whenthe robot is fully retracted. In this position the sensor may be able totell the robotic controller that it has successfully picked up a wafer31008 from a peripheral module.

Horizontal sensors 35004-35010 may also be advantageously employed. Invacuum cluster tools, horizontal sensors 35004-35010 are sometimesimpractical due to the large diameter of the vacuum chamber, which maymake alignment of the horizontal sensors 35004-35010 more complicated.In the systems described above, the chamber size may be reducedsignificantly, thus may make it practical to include one or morehorizontal sensors 35004-35010.

FIG. 23A-C illustrates other possible locations of the horizontalsensors 35004-35010 and vertical sensors 35002, such as straight acrossthe chamber (36002 and 36008) and/or through mirrors 36006 placed insidethe vacuum system.

FIG. 24A-B illustrates a possible advantage of placing the sensor 35002slightly outside the wafer 37001 radius when the robot arm is fullyretracted. During a retract motion the sensor 35002 detects the leadingedge of the wafer 37001 at point “a” 37002 and the trailing edge atpoint “b” 37004. These results may indicate that the wafer 37001 wassuccessfully retrieved, but by tying the sensor 35002 signal to theencoders, resolvers or other position elements present in the roboticdrive, one can also calculate if the wafer 37001 is centered withrespect to the end effector. The midpoint of the line segment “a-b”37002, 37004 should correspond to the center of the end effector becauseof the circular geometry of a wafer 37001. If the wafer 37001 slips onthe end effector, inconsistent length measurements may reveal theslippage.

Additionally, during a subsequent rotation and movement, a second linesegment “c-d” 37008, 37010 may be detected when the wafer 37001 edgespass through the sensor. Again, the midpoint between “c” 37008 and “d”37010 should coincide with the center of the end effector, and maypermit a measurement or confirmation of wafer centering.

The above method may allow the robot to detect the wafer 37001 as wellas determine if the wafer 37001 is off-set from the expected location onthe end effector.

The combination of horizontal and vertical sensors 35002-35010 may allowthe system to be taught very rapidly using non-contact methods: therobotic arm and end effectors may be detected optically without the needfor mechanical contact. Furthermore, the optical beams can be usedduring real-time wafer 37001 handling to verify that wafers 37001 are inthe correct position during every wafer 37001 handling move.

FIG. 25A shows high-level components of a linear processing architecture4000 for handling items in a manufacturing process. The architectureuses two or more stationary robots 4002 arranged in a linear fashion.The robots 4002 can be either mounted in the bottom of the system orhang down from the chamber lid or both at the same time. The linearsystem uses a vacuum chamber 4012 around the robot. The system could becomprised of multiple connected vacuum chambers 4012, each with a vacuumchamber 4012 containing its own robot arranged in a linear fashion. Inembodiments, a single controller could be set up to handle one or moresections of the architecture. In embodiments vacuum chambers 4012sections are extensible; that is, a manufacturer can easily addadditional sections/chambers 40 12 and thus add process capacity, muchmore easily than with cluster architectures. Because each section usesindependent robot drives 4004 and arms 4002, the throughput may stayhigh when additional sections and thus robots are added. By contrast, incluster tools, when the manufacturer adds process chambers 2002, thesystem increases the load for the single robot, even if that robot isequipped with a dual arm, eventually the speed of the robot can becomethe limiting factor. In embodiments, systems address this problem byadding additional robot arms 4002 into a single drive. Othermanufacturers have used a 4-axis robot with two completely independentarms such as a dual SCARA or dual Frog-leg robots. The linear systemdisclosed herein may not be limited by robot capacity, since eachsection 4012 contains a robot, so each section 4012 is able to transporta much larger volume of material than with cluster tools.

FIG. 25B shows a stacked vacuum load lock 4008, 40004 for enteringmaterials into a vacuum environment. One limiting factor on bringingwafers 31008 into a vacuum system is the speed with which the load lockcan be evacuated to high vacuum. If the load lock is pumped too fast,condensation may occur in the air in the load lock chamber, resulting inprecipitation of nuclei on the wafer 31008 surfaces, which can result inparticles and can cause defects or poor device performance. Clustertools may employ two load locks side by side, each of which isalternately evacuated. The pumping speed of each load lock can thus beslower, resulting in improved performance of the system. With two loadlocks 4008, 40004 in a vertical stack, the equipment footprint staysvery small, but retains the benefit of slower pumping speed. Inembodiments, the load lock 40004 can be added as an option. Inembodiments the robotic arms 4004 and 40006 can each access either oneof the two load locks 4008, 40004. In embodiments the remaining handoffmodule 7008 could be a single level handoff module.

FIG. 25C shows another load lock layout. In this figure wafers 31008 canbe entered and can exit at two levels on either side of the system, butfollow a shared level in the rest of the system.

FIG. 26 details how the previous concept of stacked load locks 4008,40004 can be also implemented throughout a process by stacking twoprocess modules 41006, 41008. Although such modules would not becompliant with the SEMI standard, such an architecture may offersignificant benefits in equipment footprint and throughput.

FIG. 27 shows a system with two handling levels 4008, 40004, 4010,42004: wafers may be independently transported between modules usingeither the top link 40006 or the bottom link 4004. Optionally, eachhandling level may have two load locks to provide the advantage ofreduced evacuation speed noted above. Thus a system with four input loadlocks, two handling levels, and optionally four output load locks, isalso contemplated by description provided herein, as are systems withadditional load lock and handling levels.

FIG. 28 shows a top view of the system of FIG. 27.

FIG. 29 depicts a special instrumented object 44014, such as a wafer.One or more sensors 44010 may be integrated into the object 44014, andmay be able to detect environmental factors around the object 44014. Thesensors 44010 may include proximity sensors such as capacitive, opticalor magnetic proximity sensors. The sensors 44010 may be connected to anamplifier/transmitter 44012, which may use battery power to transmitradio frequency or other sensor signals, such as signals conforming tothe 802.11b standard, to a receiver 44004.

In many instances it may be difficult or impossible to putinstrumentation on an object 44014 used to train a robot, because thewires that are needed to power and communicate to the instruments andsensors interfere with proper robotic motion or with the environmentthat the robot moves through. By employing a wireless connection to theobject, the problem of attached wires to the object may be resolved.

The object 44014 can be equipped with numerous sensors of differenttypes and in different geometrically advantageous patterns. In thepresent example, the sensors 1 through 6 (44010) are laid out in aradius equal to the radius of the target object 44008. In embodimentsthese sensors are proximity sensors. By comparing the transient signalsfrom the sensors 44010, for example sensor 1 and sensor 6, it can bedetermined if the object 44014 is approaching a target 44008 at thecorrect orientation. If the target 44008 is not approached correctly,one of the two sensors 44010 may show a premature trigger. By monitoringmultiple sensors 440 10, the system may determine if the object 44010 isproperly centered above the target 44008 before affecting a handoff. Thesensors 44010 can be arranged in any pattern according to, for example,efficiency of signal analysis or any other constraints. Radio frequencysignals also advantageously operate in a vacuum environment.

FIG. 30 shows the system of ,FIG. 29 in a side orientation illustratingthe non-contact nature of orienting the instrumented object 44014 to atarget 44008. The sensors 44010 may include other sensors for measuringproperties of the target 44008, such as temperature.

FIG. 31 depicts radio frequency communication with one or more sensors.A radio frequency sensor signal 440 16 may be transmitted to an antenna46002 within a vacuum. Appropriate selection of wavelengths may improvesignal propagation with a fully metallic vacuum enclosure. The use ofsensors in wireless communication with an external receiver andcontroller may provide significant advantages. For example, thistechnique may reduce the time required for operations such as findingthe center of a target, and information from the sensor(s) may beemployed to provide visual feedback to an operator, or to automatecertain operations using a robotic arm. Furthermore, the use of one ormore sensors may permit measurements within the chamber that wouldotherwise require release of the vacuum to open to atmosphere andphysically inspect the chamber. This may avoid costly or time consumingsteps in conditioning the interior of the chamber, such asdepressurization and baking (to drive out moisture or water vapor).

FIG. 32 illustrates the output from multiple sensors 44010 as a functionof the robot movement. When the robot moves over the target 44008 themotion may result in the sensors providing information about, forexample, distance to the target 44008 if the sensors are proximitysensors. The signals can be individually or collectively analyzed todetermine a location for the target 44008 relative to the sensors.Location or shape may be resolved in difference directions by moving thesensor(s) in two different directions and monitoring sensor signals,without physically contacting the target 44008.

FIG. 33A-C illustrates how multiple transfer planes may be usefullyemployed to conserve floor space in a batch processing system. FIG. 33Ashows a linking module including multiple transfer planes to accommodatesingle or multiple access to wafers within the linking module. Slotvalves or the like are provided to isolate the linking module. FIG. 33Bshows an alternative configuration in which multiple shelves arepositioned between robots without isolation. In this configuration, theshelves may, for example, be positioned above the robots to permit afull range of robotic motion that might otherwise cause a collisionbetween a robotic arm and wafers on the shelves. This configurationnonetheless provides batch processing and or multiple wafer bufferingbetween robots. FIG. 33C shows a top view of the embodiment of FIG. 33B.As visible in FIG. 33C, the small adapter with shelves between robots inFIG. 33B permits relatively close positioning of two robots withoutrequiring direct robot-to-robot handoffs. Instead each wafer or group ofwafers can be transferred to the elevated shelves for subsequentretrieval by an adjacent robot. As a significant advantage, this layoutreduces the footprint of two adjacent robots while reducing oreliminating the extra complexity of coordinating direct robot-to-robothandoffs.

FIG. 34 shows an external return system for a handling system having alinear architecture 14000. The return mechanism is optionally on the topof the linear vacuum chamber. On conventional vacuum handling systems,the return path is often through the same area as the entry path. Thisopens up the possibility of cross contamination, which occurs when cleanwafers that are moving between process steps get contaminated byresiduals entering the system from dirty wafers that are not yetcleaned. It also makes it necessary for the robot 4002 to handlematerials going in as well as materials going out, and it makes itharder to control the vacuum environment. By exiting the vacuum systemat the rear and moving the wafers on the top back to the front in an airtunnel 14012, there are some significant advantages: the air return mayrelatively cheap to implement; the air return may free up the vacuumrobots 4002 because they do not have to handle materials going out; andthe air return may keep clean finished materials out of the incomingareas, thereby lowering cross-contamination risks. Employing a smallload lock 14010 in the rear may add some costs, and so may the airtunnel 14012, so in systems that are short and where vacuum levels andcross contamination are not so important, an air return may have lessvalue, but in long systems with many integrated process steps theabove-system air return could have significant benefits. The returnsystem could also be a vacuum return, but that would be more expensiveand more complicated to implement. It should be understood that while insome embodiments a load lock 14010 may be positioned at the end of alinear system, as depicted in FIG. 34, the load lock 14010 could bepositioned elsewhere, such as in the middle of the system. In such anembodiment, a manufacturing item could enter or exit the system at suchanother point in the system, such as to exit the system into the airreturn. The advantage of a mid-system exit point may be that in case ofa partial system failure, materials or wafers can be recovered. Theadvantage of a mid-system entry point may be that wafers can be insertedin multiple places in the system, allowing for a significantly moreflexible process flow. In effect a mid system entry or exit positionbehaves like two machines connected together by the mid-system position,effectively eliminating an EFEM position. It should also be understoodthat while the embodiment of FIG. 34 and subsequent figures is astraight line system, the linear system could be curvilinear; that is,the system could have curves, a U- or V-shape, an S-shape, or acombination of those or any other curvilinear path, in whatever formatthe manufacturer desires, such as to fit the configuration of afabrication facility. In each case the system optionally includes anentry point and an exit point that is down the line (although optionallynot a straight line) from the entry point. Optionally the air returnreturns the item from the exit point to the entry point. Optionally thesystem can include more than one exit point. In each case the roboticarms described herein can assist in efficiently moving items down theline, without the problems of other linear systems. FIG. 34A shows anexample of a U-shaped linear system.

Referring still to FIG. 34, an embodiment of the system uses a dualcarrier mechanism 14008 so that wafers that are finished can quickly bereturned to the front of the system, but also so that an empty carrier14008 can be placed where a full one was just removed. In embodimentsthe air return will feature a carrier 14008 containing N wafers. N canbe optimized depending on the throughput and cost requirements. Inembodiments the air return mechanism may contain empty carriers 14008 sothat when a full carrier 14018 is removed from the vacuum load lock14010, a new empty carrier 14008 can immediately be placed and load lock14010 can evacuated to receive more materials. In embodiments the airreturn mechanism may be able to move wafers to the front of the system.At the drop-off point a vertical lift 14004 may be employed to lower thecarrier to a level where the EFEM (Equipment Front End Module) robot canreach. At the load lock point(s) the vertical lift 14004 can lower topick an empty carrier 14008 from the load lock.

In embodiments the air return mechanism may feature a storage area 14014for empty carriers 14008, probably located at the very end and behindthe location of the load lock 14010. The reason for this is that whenthe load lock 14010 releaes a carrier 14018, the gripper 14004 can gripthe carrier 14018 and move it forward slightly. The gripper 14004 canthen release the full carrier 14018, move all the way back and retrievean empty carrier 14008, place it on the load lock 14010. At this pointthe load lock 14010 can evacuate. The gripper 14004 can now go back tothe full carrier 14018 and move it all the way to the front of thesystem. Once the carrier 14018 has been emptied by the EFEM, it can bereturned to the very back where it waits for the next cycle.

It is also possible to put the lift in the load lock rather than usingthe vertical motion in the gripper, but that would be more costly. Itwould also be slightly less flexible. A manufacturer may want a verticalmovement of the carrier 14018 in a few places, and putting it in thegripper 14004 would be more economical because the manufacturer thenonly needs one vertical mechanism.

FIG. 35 shows certain additional details of an external return systemfor a handling system of FIG. 34.

FIG. 36 shows additional details of an external return system for ahandling system of FIG. 34.

FIG. 37 shows movement of the output carrier 14018 in the return tunnel14012 of FIG. 34. The gripper 14004 is shown in a position 17002 withinthe return tunnel 14012 away from the load lock 14010. Once in thereturn tunnel 14012 the gripper 14004 may move to any available position17012 within the return tunnel 14012.

FIG. 38 shows handling of an empty carrier 14008 in the return system14012 of FIG. 34.

FIG. 39 shows movement of the empty carrier 14008 in the return tunnel14012 of FIG. 34 into a load lock 14010 position.

FIG. 40 shows the empty carrier 14008 lowered and evacuated and movementof the gripper 14004 in the return system of FIG. 34.

FIG. 41 shows an empty carrier 14008 receiving material as a fullcarrier 14018 is being emptied in the return tunnel 14012 of FIG. 34.

FIG. 42 shows an empty carrier 14008 brought to a holding position,starting a new return cycle in the return tunnel 14012 of FIG. 34.

FIG. 43 shows an architecture for a handling facility for amanufacturing process, with a dual-arm robotic arm system 23002 and areturn system in a linear architecture.

FIG. 44 shows an alternative embodiment of an overall systemarchitecture for a handling method and system of the present invention.

FIG. 45 illustrates a fabrication facility including a mid-entry point33022. In an embodiment, the fabrication facility may include a loadlock 14010 mid-stream 33002 where wafers 31008 can be taken out orentered. There can be significant advantages to such a system, includingproviding a processing facility that provides dual processingcapabilities (e.g. connecting two machines behind each other, but onlyneed to use one EFEM). In an embodiment, the air return system 14012 canalso take new wafers 31008 to the midpoint 33022 and enter wafers 31008there.

It will be understood that, while specific modules and layouts are havebeen described in detail, these examples are not intended to belimiting, and all such variations and modifications as would be apparentto one of ordinary skill in the art are intended to fall within thescope of this disclosure. For example, while FIG. 12 depicts two robotsin a shared common environment handling wafers for the modules 1202, avariety of other arrangements are possible. For example, all of theentries 1204 may be serviced by a single robot as described above withreference to FIG. 11, or the entries 1204 may be serviced by a pair ofrobots separated by an isolated buffer as described above with referenceto FIG. 9. As another example, while numerous examples are providedabove of dual entry or dual process modules, these concepts may bereadily adapted to three entry or three process modules, or moregenerally, to any number of modules consistent with a particularfabrication facility or process.

Further, it should be understood that the devices disclosed herein maybe combined in various ways within a semiconductor fabrication system,for example to form fabrication facilities adapted to balance processingload among relatively fast and relatively slow processes, or betweenprocesses amenable to batch processing and processes that are dedicatedto a single wafer. Thus, while a number of specific combinations ofmodules are shown and described above, it will be appreciated that thesecombinations are provided by way of illustration and not by way oflimitation, and that all combinations of the process modules disclosedherein that might usefully be employed in a semiconductor fabricationsystem are intended to fall within the scope of this disclosure.

More generally, it will be understood that, while various features ofprocess modules are described herein by way of specific examples, thatnumerous combinations and variations of these features are possible andthat, even where specific combinations are not illustrated or describedin detail, all such combinations that might be usefully employed in asemiconductor manufacturing environment are intended to fall within thescope of this disclosure.

1. A method comprising: providing a pair of vertically stacked load locks; providing at least two workpiece handling robotic facilities positioned on different sides of the pair of vertically stacked load locks and connected to the pair of vertically stacked load locks to form a vacuum handling system having a vacuum environment therein for transferring workpieces between the pair of vertically stacked load locks; and delivering a workpiece between the pair of vertically stacked load locks with an air-based workpiece delivery system, where the air-based workpiece delivery system provides transfer of workpieces between the pair of vertically stacked load locks and is isolated from the vacuum handling system.
 2. The method of claim 1, further including adding at least one of a semiconductor processing module and a wafer handling robotic facility to the vacuum handling system without reconfiguring existing components of the vacuum handling system.
 3. The method of claim 1, further including configuring the at least two workpiece handling robotic facilities in the vacuum handling system to facilitate sequential processing of a workpiece by a first robot handing off the workpiece to a second robot between two sequential processes.
 4. The method of claim 1, wherein at least one of the robotic handling facilities includes a plurality of modular interfaces that each supports connection to other workpiece handling modules to extend the vacuum environment.
 5. The method of claim 1, further including detecting a module that is connected to the vacuum handling system and causing control software associated with the connected module to be operationally linked to system control software associated with the vacuum handling system.
 6. The method of claim 1, further including providing a module connected to the vacuum handling system that includes wafer storage features that are accessible by at least one robotic handling facility.
 7. The method of claim 1, wherein the vacuum handling system includes at least two different wafer processing modules for performing a process, the process selected from a list consisting of chemical vapor deposition, physical vapor deposition, etching, plasma processing, lithography, plating, cleaning, and spin coating.
 8. A semiconductor handling system comprising: a vacuum workpiece handling system having a vacuum environment therein, the vacuum workpiece handling system including at least two workpiece handling robotic facilities and a pair of vertically stacked load locks positioned between the at least two workpiece handling robotic facilities, the at least two workpiece handling robotic facilities being configured to transfer workpieces between the pair of vertically stacked load locks; and an air-based workpiece delivery system for transporting a workpiece between the pair of vertically stacked load locks, the air-based workpiece delivery system being isolated from the vacuum workpiece handling system.
 9. The system of claim 8, further including a load lock wherein at least one of the at least two workpiece handling robotic facilities is disposed between the load lock and the pair of vertically stacked load locks.
 10. The system of claim 9, wherein the air-based workpiece delivery system is adapted to transport a workpiece between at least one of the pair of vertically stacked load locks and the load lock.
 11. The system of claim 8, wherein at least one of a semiconductor processing module and a wafer handling robotic facility can be added to the semiconductor handling system without reconfiguring existing components of the vacuum workpiece handling system.
 12. The system of claim 8, wherein at least one of the robotic handling facilities includes a plurality of modular interfaces that each supports connection to other workpiece handling modules to extend the vacuum environment.
 13. The system of claim 8, further including module control software that is operationally linked to system control software associated with the vacuum system when a connection between a module and the vacuum system is detected.
 14. The system of claim 8, further including a module connected to the vacuum handling system that includes wafer storage features that are accessible by at least one robotic handling facility.
 15. The system of claim 8, wherein the vacuum handling system includes at least two different wafer processing modules selected from a list consisting of standard width, double width, stretch width, sub chamber divided, batch process, double sided entry, and scanning electron microscope. 